双面板流程-ChangZhou Techelect Electronic Equipment Company

Double side PCB board production process:

1.Shearing → 2.Positioning hole shooting → 3.CNC drilling → 4.Deburring → 5.Electroless copper(PTH) → 6.Pre treatment brushing →7.Dry film lamination →8.Circuit Exposure → 9.Circuit Developing → 10.Pattern copper plating → 11.Film stripping → 12.Etching → 13.Lead tin stripping → 14.Mid treatment brushing →15.Solder mask silk printing → 16.Drying oven →17.Solder mask exposure→18.Soler mask developing →19.OSP(Anti-oxidation) →20.Charater silk printing → 21.UV curing → 22. Punching/V cutting → 23. Finished products cleaning → 24. Circuit testing and packing

Production Process：

1.Shearing machine
2.Positioning hole shooting
3.CNC drilling machine
4.Deburring machine
5.Electroless copper(PTH)
6.Pre Brushing machine
7.Dry film lamination
8.Circuit exposure
9.Circuit developing
10.Pattern copper plating(Secondary copper)
11.Film stripping
12.Etching
13.Lead tin stripping
14.Mid treatment brushing
15.Solder mask silk printing machine
16.Hot drying oven
17.Solder mask exposure
18.Solder mask developing
19.OSP line
20.Character silk printing
21、UV固化机
21.UV curing machine(Light curing)
22.Punching machine
23.Finished products cleaning machine
24.Circuit testing machine